연혁
1.Semiconductor Chip Decapsolution M/C (국책과제)
2.Micro Laser Bonder(Probe Card 생산)
3.Micro Patterning M/C(Bio Sensor 회로 제작)
4.Laser Solder Ball Jetting M/C(국책과제)
5.Laser Flip Chip Bonder
6.Laser Reflow M/C
08.Medical Care 3D Printer Development
07.For Next Generation Display Laser Soldering M/C Development
㈜아큐레이저로 사명변경
06.본사이전(미건테크노월드 2차)
05.Wide Ares Homogeneity Soldering Optics Development
08.㈜우림피엔피 설립
